Part Number Hot Search : 
200BG PN200A S18012 M358D BC858C 200BG DUG38A S225F
Product Description
Full Text Search
 

To Download MC10E411FN Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 MC10E411 5V ECL 1:9 Differential PECL/NECL RAMBus Clock Buffer
Description
The MC10E411 is a low skew 1-to-9 differential driver, designed with clock distribution in mind. The MC10E411's function and performance are similar to the popular MC10E111, with the added feature of 1.2 V output swings. The output voltage swing of the E411 is larger than a standard ECL swing. The 1.2 V output swings provide a signal which can be AC coupled into RAMBus compatible input loads. The larger output swings are produced by lowering the VOL of the device. With the exception of the lower VOL, the E411 is identical to the MC10E111. Note that the larger output swings eliminate the possibility of temperature compensated outputs, thus the E411 is only available in the 10E style of ECL. In addition, because the VOL is lower than standard ECL, the outputs cannot be terminated to -2.0 V. This data sheet provides a few termination alternatives. The device TPD is affected by the quantity of output pairs terminated with minimum occurring with only one output pair and increasing about 10 - 20 ps for all output pairs. Relative skew distribution is not affected as more pairs are terminated, but the increased TPD does shift the entire distribution. Unused output pairs should be left unterminated (open) to reduce power and switching noise. The VBB pin, an internally generated voltage supply, is available to this device only. For single-ended input conditions, the unused differential input is connected to VBB as a switching reference voltage. VBB may also rebias AC coupled inputs. When used, decouple VBB and VCC via a 0.01 mF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open.
Features
http://onsemi.com
PLCC-28 FN SUFFIX CASE 776
MARKING DIAGRAM*
1 28
MC10E411FNG AWLYYWW
A WL YY WW G
= Assembly Location = Wafer Lot = Year = Work Week = Pb-Free Package
*For additional marking information, refer to Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.
* * * * * * * *
200 ps Part-to-Part Skew 50 ps Output-to-Output Skew Differential Design VBB Output Voltage Compensated Outputs PECL Mode Operating Range: VCC = 4.5 V to 5.5 V with VEE = 0 V NECL Mode Operating Range: VCC = 0 V with VEE = -4.5 V to -5.5 V Internal Input 50 kW Pulldown Resistors
* ESD Protection: Human Body Model; > 2 kV, * * * * *
Machine Model; > 200 V Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test Moisture Sensitivity Level: Pb = 1; Pb-Free = 3 For Additional Information, see Application Note AND8003/D Flammability Rating: UL 94 V-0 @ 1.125 in, Oxygen Index: 28 to 34 Transistor Count = 180 devices Pb-Free Packages are Available*
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
(c) Semiconductor Components Industries, LLC, 2006
November, 2006 - Rev. 8
1
Publication Order Number: MC10E411/D
MC10E411
Q0 25 VEE EN IN VCC IN VBB NC 26 27 28 1 2 3 4 5 Q8 6 Q8 7 8 9 10 Q6 11 Q6 Pinout: 28-Lead PLCC (Top View) Q0 24 Q1 VCCO Q1 23 22 21 Q2 20 Q2 19 18 17 16 15 14 13 12 Q3 Q3 Q4 VCCO Q4 Q5 Q5 EN IN IN Q0 Q0 Q1 Q1 Q2 Q2 Q3 Q3 Q4 Q4 Q5 Q5 Q6 Q6 Q7 Q7 Q8 VBB Q8
Q7 VCCO Q7
All VCC and VCCO pins are tied together on the die Warning: All VCC, VCCO, and VEE pins must be externally connected to Power Supply to guarantee proper operation.
Figure 1. 28-Lead Pinout Assignment
Figure 2. Logic Diagram
Table 1. PIN DESCRIPTION
PIN IN, IN EN Q0, Q0-Q8, Q8 VBB VCC, VCCO VEE NC FUNCTION ECL Differential Input Pair ECL Enable ECL Differential Outputs Reference Voltage Output Positive Supply Negative Supply No Connect
VCC
VCC
RS = ZO
ZO RAMBus Load
ZO VOH and VOL levels will vary slightly from specification table RL = ZO VCC -2.4 V
300 W VEE
Figure 3. Termination Alternatives
http://onsemi.com
2
MC10E411
Table 2. MAXIMUM RATINGS
Symbol VCC VI Iout IBB TA Tstg qJA qJC Tsol Parameter PECL Mode Power Supply PECL Mode Input Voltage NECL Mode Input Voltage Output Current VBB Sink/Source Operating Temperature Range Storage Temperature Range Thermal Resistance (Junction-to-Ambient) Thermal Resistance (Junction-to-Case) Wave Solder Pb Pb-Free 0 lfpm 500 lfpm Standard Board PLCC-28 PLCC-28 PLCC-28 Condition 1 VEE = 0 V VEE = 0 V VCC = 0 V Continuous Surge VI VCC VI VEE Condition 2 Rating 8 6 -6 50 100 0.5 0 to +85 -65 to +150 63.5 43.5 22 to 26 265 265 Unit V V V mA mA mA C C C/W C/W C/W C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
http://onsemi.com
3
MC10E411
Table 3. 10E SERIES PECL DC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V (Note 1)
0C Symbol IEE VOH VOL VIH VIL VBB VIHCMR IIH Characteristic Power Supply Current Output HIGH Voltage (Note 2) Output LOW Voltage (Note 2) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 3) Input HIGH Current 3980 2580 3830 3050 3.62 3.4 Min Typ 55 4070 2750 3995 3285 Max 65 4160 2920 4160 3520 3.73 4.6 150 4020 2620 3870 3050 3.65 3.4 Min 25C Typ 55 4105 2785 4030 3285 Max 65 4190 2950 4190 3520 3.75 4.6 150 4090 2690 3940 3050 3.69 3.4 Min 85C Typ 55 4185 2865 4110 3302 Max 65 4280 3040 4280 3555 3.81 4.6 150 Unit mA mV mV mV mV V V mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 1. Input and output parameters vary 1:1 with VCC. VEE can vary +0.5 V / -0.5 V. 2. Outputs are terminated through a 300 W resistor to VEE. 3. VIHCMR min and max vary 1:1 with VCC.
Table 4. 10E SERIES NECL DC CHARACTERISTICS VCCx = 0.0 V; VEE = -5.0 V (Note 4)
0C Symbol IEE IEE VOH VOL VIH VIL VBB VIHCMR IIH IIL Characteristic Power Supply Current Power Supply Current Output HIGH Voltage (Note 5) Output LOW Voltage (Note 5) Input HIGH Voltage (Single-Ended) Input LOW Voltage (Single-Ended) Output Voltage Reference Input HIGH Voltage Common Mode Range (Differential Configuration) (Note 6) Input HIGH Current Input LOW Current 0.5 0.3 -1020 -2420 -1170 -1950 -1.38 -1.6 Min Typ 130 55 -930 -2250 -1005 -1715 Max 156 65 -840 -2080 -840 -1480 -1.27 -2.4 150 0.5 0.065 -980 -2380 -1130 -1950 -1.35 -1.6 Min 25C Typ 130 55 -895 -2215 -970 -1715 Max 156 65 -810 -2050 -810 -1480 -1.25 -0.4 150 0.3 0.2 -910 -2310 -1060 -1950 -1.31 -1.6 Min 85C Typ 130 55 -815 -2135 -890 -1698 Max 156 65 -720 -1960 -720 -1445 -1.19 -0.4 150 Unit mA mA mV mV mV mV V V mA mA
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Input and output parameters vary 1:1 with VCC. VEE can vary +0.5 V / -0.5 V. 5. Outputs are terminated through a 300 W resistor to VEE. 6. VIHCMR min and max vary 1:1 with VCC.
http://onsemi.com
4
MC10E411
Table 5. AC CHARACTERISTICS VCCx = 5.0 V; VEE = 0.0 V or VCCx = 0.0 V; VEE = -5.0 V (Note 7)
0C Symbol fMAX tPLH tPHL Characteristic Maximum Toggle Frequency Propagation Delay to Output IN (Differential) (Note 8) IN (Single-Ended) (Note 9) EN to Q Setup Time (Note 10) Hold Time (Note 11) Release Time (Note 12) Within-Device Skew (Note 13) Part-to-Part Skew (Diff) Random Clock Jitter (RMS) Input Voltage Swing (Differential Configuration) Output Rise/Fall Time (20%-80%) 250 275 <1 1000 600 250 275 EN to IN IN to EN EN to IN 400 350 450 200 0 300 0 -200 100 50 200 <1 1000 600 250 275 Min Typ 700 600 650 850 430 380 450 200 0 300 0 -200 100 50 200 <1 1000 600 Max Min 25C Typ 700 630 680 850 500 450 450 200 0 300 0 -200 100 50 200 Max Min 85C Typ 700 700 750 850 Max Unit MHz ps
ts tH tR tskew tJITTER VPP tr/tf
ps ps ps ps ps mV ps
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 7. VEE can vary +0.5 V / -0.5 V. 8. The differential propagation delay is defined as the delay from the crossing points of the differential input signals to the crossing point of the differential output signals. 9. The single-ended propagation delay is defined as the delay from the 50% point of the input signal to the 50% point of the output signal. 10. The setup time is the minimum time that EN must be asserted prior to the next transition of IN/IN to prevent an output response greater than 75 mV to that IN/IN transition. 11. The hold time is the minimum time that EN must remain asserted after a negative going IN or a positive going IN to prevent an output response greater than 75 mV to that IN/IN transition. 12. The release time is the minimum time that EN must be deasserted prior to the next IN/IN transition to ensure an output response that meets the specified IN to Q propagation delay and output transition times. 13. The within-device skew is defined as the worst case difference between any two similar delay paths within a single device.
http://onsemi.com
5
MC10E411
Q Driver Device Q Zo = 50 W 50 W 50 W D Zo = 50 W D Receiver Device
VTT
VTT = VCC - 2.4 V
Figure 4. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D - Termination of ECL Logic Devices.)
ORDERING INFORMATION
Device MC10E411FN MC10E411FNG MC10E411FNR2 MC10E411FNR2G Package PLCC-28 PLCC-28 (Pb-Free) PLCC-28 PLCC-28 (Pb-Free) Shipping 37 Units / Rail 37 Units / Rail 500 / Tape & Reel 500 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D AN1406/D AN1503/D AN1504/D AN1568/D AN1672/D AND8001/D AND8002/D AND8020/D AND8066/D AND8090/D - ECL Clock Distribution Techniques - Designing with PECL (ECL at +5.0 V) - ECLinPSt I/O SPiCE Modeling Kit - Metastability and the ECLinPS Family - Interfacing Between LVDS and ECL - The ECL Translator Guide - Odd Number Counters Design - Marking and Date Codes - Termination of ECL Logic Devices - Interfacing with ECLinPS - AC Characteristics of ECL Devices
http://onsemi.com
6
MC10E411
PACKAGE DIMENSIONS
PLCC-28 FN SUFFIX PLASTIC PLCC PACKAGE CASE 776-02 ISSUE E
Y BRK D Z -L- -M- B 0.007 (0.180) U
M
T L-M
M
S
N
S S
-N-
0.007 (0.180)
T L-M
N
S
W
28 1
D
V
X VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R E G G1 0.010 (0.250)
S
0.007 (0.180) 0.007 (0.180)
M M
T L-M T L-M
S S
N N
S S
H
0.007 (0.180)
M
T L-M
S
N
S
C
K1 0.004 (0.100) -T- SEATING
PLANE
J
K F VIEW S 0.007 (0.180)
M
VIEW S T L-M
S
T L-M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10_ 0.410 0.430 0.040 ---
MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10_ 10.42 10.92 1.02 ---
http://onsemi.com
7
MC10E411
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
http://onsemi.com
8
MC10E411/D


▲Up To Search▲   

 
Price & Availability of MC10E411FN

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X